News: The call for paper flyer of icOPEN 2019 can be viewed and download
here (click to view). Welcome to join us!

Optical and Photonic Engineering

Introduction

Welcome to icOPEN 2019!

The International Conference on Optical and Photonic Engineering (icOPEN) is the flagship event of the Optics and Photonics Society of Singapore (OPSS). Since its inception in 2011, the conference has grown by leaps and bounds, so much so that the conference is now an annual fixture in Optical and Photonic Engineering calendar. Traditionally the event alternates between Singapore and China but with the emergence of our ASEAN neighbours, the icOPEN2019 will be held not in Singapore but in Thailand. Indeed the icOPEN2019 will propel the newly minted ASEAN Commission on Optics and Photonics (ACOP) to become a strong regional player in this community.

Phuket, Thailand has long been known for its idyllic beaches and wonderful cuisine. Furthermore with its ease of access from most international destination, it is growing as a hub for academic and research conferences. We envisage that this event would be a good confluence of technical advances and friendly exchanges in the sun and sand.

On behalf of the ACOP member countries, the Optics and Photonics Society of Singapore (OPSS) would like to welcome you to this global conference to share your ideas and experience and enjoy the company of new and old friends.

Publication

icOPEN 2019 conference proceedings will be published by SPIE, which will be included in SPIE Digital Library, provided to the Web of Science Conference Proceedings Citation Index-Science, Scopus, Ei Compendex, and others, to ensure maximum awareness of the Proceedings.

Topics

The primary focus of the conference is on new and original research results in the areas of theoretical findings, design, implementation and applications. Both theoretical paper and simulation (experimental) results are welcome. Topics of interest include, but are not limited to the following：(If you want to join the special session, please read the special session announcement before submission click here to read .)

General Session Topics 3D Computer Vision 3D Image Acquisition and Display Biomedical Optics and Imaging Diffractive and Freeform Optics Digital Holography and Quantitative Phase Imaging Fiber Optics and Sensing Technology High Resolution Optical Metrology Image Processing and Deep Learning Information-rich Metrology Laser Micro-nano Processing and Patterning Non-Destructive Testing and Inspection Optical component and System Simulation Optical Functional Materials and Devices Optical Art Photomechanics Terahertz Science and Technology Ultrafast Lasers and Applications

Special Session Topics Laser Interferometry Advances in Digital Holography Techniques High-accuracy Optical Deformation Measurement of Large Engineering Structures Optical Imaging and Machine Vision 2D-/Stereo-/Volumetric Digital Image Correlation and their Applications Non-destructive Evaluation and Testing Optics Art Optical Fabrication and Testing Intelligent 3D Imaging and Computing Deformation and Shape Measurement High-speed 3D Metrology Advanced Optical Profilometry Optical Methods in Experimental Mechanics Information-rich Metrology Deflectometry Coherent and Incoherent Biophase Imaging Micro/Nano Optics and Materials

Important Dates

Abstract Submission Deadline	March 15, 2019 Extended to April 5, 2019
Notification Date	April 15, 2019
Early Bird Registration Deadline	May 15, 2019
Full Paper Submission Deadline	May 31, 2019
Final Registration Deadline	June 15, 2019

Submission

Participant needs to submit the abstract before the deadline first. After the abstract passed the review, if you wish to publish your paper, please submit the full paper of the same abstract before the deadline. Full paper review result will be sent to you 2 weeks later.

Only the accepted full papers will be published on the conference proceedings and indexed. Submission requirements and methods can be found on the Submission Page. Please strictly follow the instruction and template when submitting your manuscript.

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